PCB Layout

We need this job done in 1 day. The schematic was done with Orcad Capture 9.2.3 There is a total of 33 unique components with 163 component placements. We will require a signed NDA before releasing the files. The person that is awarded this job will be provided with all datasheets, the schematic and BOM. 1. The board cannot be any bigger than 3”x5” 2. Place all components on one side. 3. Place 4 non plated mounting holes 1/8” x 1/4” from corners of board. 4. Hole dia (115 mill) to accommodate a #4 screw (Spec sheet included in datasheet zip file) to ensure screw head does not overlap components. 5. Any components that can build up heat, please add copper pour, and use pin wheel (thermal relief) style pads for any through hole soldering connections. 6. Make sure there is no silkscreen over the top of VIA’s, and no silkscreen on any pads. 7. 20mil minimum annual rings required for all through hole components 8. All components that connect to ground, or solder pour, please use pin wheel (thermal relief) style pads to assist with through hole soldering. 9. Min hole size .015” 10. Min trace distance between traces 8mil. 11. 2oz Copper finished 12. All DC Power traces to be 25mil Min and spaced at least 15 mil apart 13. All AC power traces to be 40mil Min and spaced at least 15 mil apart 14. The following 2N6497 locations Q1,Q2,Q3,Q4,Q5,Q6 may have clip on heatsinks, please lay them all out side by side so we can use a custom heat sink bar across all of them. 15. Fabrications Notes below should show on the drill layer: Board Name, Rev Material: FR4, 0.062” +/- .007 Type: DSPTH, SMOBC, HASL Free RoHS Compliant Plating at finish 2oz Silk Screen White Epoxy Tolerances are in inches Holes: +/- .003 (after plating) Route: +/- .005