The company has hardware design and PCBLayout printing layout design capabilities, and has done example projects including AD9361, AD9371, ADRV9009 daughter cards, other series of AD/DA daughter cards, various FPGA board design, Altrea (Cyclone series Arria series, etc.) and xilinx (A7 series, K7 series, spartan series, ZYNQ series, etc.) composed of analog-digital hybrid boards, various pure digital high-speed boards, RF communication transceivers, 25/28Gbps high-speed optical network transceiver board bayonet, 100M, Gigabit Ethernet port, etc.
Technical strength parameters:
The highest design layer: 24 layers
Maximum PIN number: 25000+
Maximum number of connections: 13000+
Minimum line width: 2.5mil
Minimum line spacing: 2.5mil
Minimum via hole size: 8mil (4mil laser hole); 3/6mil (chip-level design)
Maximum number of BGAs per PCB board: 30
Minimum BGA pin-pith: 0.4mm; 0.24mm (chip-level design)
Maximum BGA PIN number: 1679
Highest speed signal: 10 GHz differential signal
The specific quotation should be evaluated after seeing the project, and after friendly negotiation between the two parties shall prevail.